Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930613 | Semiconductor package having recessed adhesive layer between stacked chips | Sang-Sick Park, Un-Byoung Kang, Tae Hong Min, Ji Hwan Hwang | 2021-02-23 |
TL
Teak-Hoon Lee
Overall (2021): #237,837 of 548,734Top 45%
1
Patents 2021