Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062970 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Nachiket R. Raravikar | 2021-07-13 |
| 10969840 | Heat spreaders with interlocked inserts | Aravindha R. Antoniswamy, Zhizhong Tang, Wei Hu | 2021-04-06 |