| 11201096 |
Packaged device with die wrapped by a substrate |
— |
2021-12-14 |
| 11195811 |
Dielectric and metallic nanowire bond layers |
Scott R. Summerfelt, Benjamin Stassen Cook, Ralf Jakobskrueger Muenster |
2021-12-07 |
| 11177195 |
Multi-lead adapter |
Abram Castro |
2021-11-16 |
| 11152322 |
Leadframes in semiconductor devices |
— |
2021-10-19 |
| 11094616 |
Multi-pitch leads |
Nazila Dadvand |
2021-08-17 |
| 11094620 |
Integrated capacitor with extended head bump bond pillar |
— |
2021-08-17 |
| 11094659 |
Microelectronic device with pillars having flared ends |
— |
2021-08-17 |
| 11064615 |
Wafer level bump stack for chip scale package |
— |
2021-07-13 |
| 10991641 |
Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies |
Benjamin Michael Sutton, Subhashish Mukherjee |
2021-04-27 |
| 10985096 |
Electrical device terminal finishing |
— |
2021-04-20 |
| 10957666 |
Pre-molded leadframes in semiconductor devices |
— |
2021-03-23 |
| 10957635 |
Multi-chip package with high thermal conductivity die attach |
Nazila Dadvand, Benjamin Stassen Cook |
2021-03-23 |
| 10892209 |
Semiconductor device with metal die attach to substrate with multi-size cavity |
Benjamin Stassen Cook, Nazila Dadvand |
2021-01-12 |