Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991641 | Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies | Sreenivasan K. Koduri, Subhashish Mukherjee | 2021-04-27 |
| 10978239 | Embedded coil assembly and method of making | Haiying Li, Ming Li | 2021-04-13 |