Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10991641 | Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies | Sreenivasan K. Koduri, Subhashish Mukherjee | 2021-04-27 | $48,370,000 |
| 10978239 | Embedded coil assembly and method of making | Haiying Li, Ming Li | 2021-04-13 | $33,270,000 |