Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037802 | Package substrate having copper alloy sputter seed layer and high density interconnects | Robert Alan May, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram | 2021-06-15 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037802 | Package substrate having copper alloy sputter seed layer and high density interconnects | Robert Alan May, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram | 2021-06-15 |