Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10998248 | Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die | Yaojian Lin, Jun Mo Koo | 2021-05-04 |
| RE48408 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Seng Guan Chow, Seung Uk Yoon, Byung Tai Do, Linda Pei Ee Chua | 2021-01-26 |