Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE48408 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Seung Uk Yoon, Byung Tai Do | 2021-01-26 |