Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205588 | Interconnect architecture with enhanced reliability | Baozhen Li, Chih-Chao Yang | 2021-12-21 |
| 11133268 | Crack bifurcation in back-end-of-line | Tuhin Sinha | 2021-09-28 |
| 11011415 | Airgap vias in electrical interconnects | Rasit Onur Topaloglu, Matthew S. Angyal | 2021-05-18 |
| 10998263 | Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device | Jim Shih-Chun Liang, Baozhen Li, Ning Lu | 2021-05-04 |