Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018152 | Method for etching bottom punch-through opening in a memory film of a multi-tier three-dimensional memory device | Tatsuya Hinoue, Kengo Kajiwara, Ryousuke Itou | 2021-05-25 |
| 11011506 | Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same | Kazuma Shimamoto, Tetsuya Shirasu, Yuji Fukano, Akio Nishida | 2021-05-18 |
| 10903237 | Three-dimensional memory device including stepped connection plates and methods of forming the same | Hiroyuki Ogawa, Yuki Mizutani | 2021-01-26 |