Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018152 | Method for etching bottom punch-through opening in a memory film of a multi-tier three-dimensional memory device | Tatsuya Hinoue, Kengo Kajiwara, Naohiro Hosoda | 2021-05-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018152 | Method for etching bottom punch-through opening in a memory film of a multi-tier three-dimensional memory device | Tatsuya Hinoue, Kengo Kajiwara, Naohiro Hosoda | 2021-05-25 |