Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158607 | Wafer reconstitution and die-stitching | Sanjay Dabral, Jun Zhai, Kunzhong Hu, Vidhya Ramachandran | 2021-10-26 |
| 11056373 | 3D fanout stacking | Jun Zhai, Kunzhong Hu | 2021-07-06 |
KL
Kwan-Yu Lai
Overall (2021): #139,160 of 548,734Top 30%
2
Patents 2021