Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11196360 | System and method for electrostatically chucking a substrate to a carrier | Alexander Lerner, Steven Trey Tindel | 2021-12-07 |
| 11183411 | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency | Alexander Lerner, Steven Trey Tindel | 2021-11-23 |
| 11047039 | Substrate carrier having hard mask | Alexander Lerner, Ami Sade, Steven V. Sansoni, Andrew J. Constant, Kevin Moraes +4 more | 2021-06-29 |
| 10916464 | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency | Alexander Lerner, Steven Trey Tindel | 2021-02-09 |