Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11196360 | System and method for electrostatically chucking a substrate to a carrier | Alexander Lerner, Kim Vellore | 2021-12-07 |
| 11183411 | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency | Kim Vellore, Alexander Lerner | 2021-11-23 |
| 10916464 | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency | Kim Vellore, Alexander Lerner | 2021-02-09 |