Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145632 | High density die package configuration on system boards | Hyoung Il Kim, Bilal Khalaf, John G. Meyers | 2021-10-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145632 | High density die package configuration on system boards | Hyoung Il Kim, Bilal Khalaf, John G. Meyers | 2021-10-12 |