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Device and method for alignment of vertically stacked wafers and die |
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| 11152307 |
Buried local interconnect |
Kangguo Cheng, Lawrence A. Clevenger, Carl Radens, Junli Wang |
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DRAM interconnect structure having ferroelectric capacitors exhibiting negative capacitance |
— |
2021-07-13 |
| 11049862 |
Semiconductor device and fabrication method thereof |
Yanzun Li, Guoliang Zhu, Tongqing Chen, Huang Liu |
2021-06-29 |
| 11031504 |
Gate all around vacuum channel transistor |
— |
2021-06-08 |
| 10985063 |
Semiconductor device with local connection |
Kangguo Cheng, Lawrence A. Clevenger, Carl Radens, Junli Wang |
2021-04-20 |
| 10964551 |
Control of wafer surface charge during CMP |
— |
2021-03-30 |
| 10950722 |
Vertical gate all-around transistor |
Carl Radens, Lawrence A. Clevenger, Yiheng Xu |
2021-03-16 |
| 10943837 |
Device having overlapping semiconductor fins oriented in different directions |
Qing Liu |
2021-03-09 |
| 10937811 |
Integrated circuit devices and fabrication techniques |
— |
2021-03-02 |
| 10930553 |
Forming self-aligned vias and air-gaps in semiconductor fabrication |
Lawrence A. Clevenger, Carl Radens |
2021-02-23 |
| 10910385 |
Vertical gate-all-around TFET |
— |
2021-02-02 |
| 10892281 |
Method for manufacturing a transistor having a sharp junction by forming raised source-drain regions before forming gate regions and corresponding transistor produced by said method |
— |
2021-01-12 |
| 10892344 |
Atomic layer deposition of selected molecular clusters |
— |
2021-01-12 |