Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177205 | Semiconductor package having multi-level and multi-directional shape narrowing vias | Jung-Ho Park, Min Jun Bae | 2021-11-16 |
| 11101231 | Semiconductor package and method of manufacturing the same | Seok Hyun LEE, Youn-ji Min, Kyoung Lim Suk, Seok-Won Lee | 2021-08-24 |