Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950521 | Thermal interface material layer and package-on-package device including the same | Min-Ok Na, Hyo-Chang Ryu, Jin-Woo Park, BongJin Son, Jangwoo Lee | 2021-03-16 |
JK
Jongkook Kim
Overall (2021): #396,832 of 548,734Top 75%
1
Patents 2021