Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957850 | Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication | Ashim Dutta, Son V. Nguyen, Michael Rizzolo, John C. Arnold | 2021-03-23 |
IC
Isabel Cristina Chu
Overall (2021): #423,534 of 548,734Top 80%
1
Patents 2021