Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018120 | Semiconductor device package with stress buffering layer and method for manufacturing the same | Chien-Mei Huang, Shih-Yu Wang, Wen-Hung Huang, Yuh-Shan Su, Chih-Cheng Lee +1 more | 2021-05-25 |