Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11137559 | Optical chip package and method for forming the same | Jiun-Yen LAI, Yu-Ting Huang, Tsang-Yu Liu, Hui-Hsien Wu | 2021-10-05 |
| 11107759 | Chip package and manufacturing method thereof | Wei-Luen SUEN, Jiun-Yen LAI, Tsang-Yu Liu | 2021-08-31 |