Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177220 | Vertical and lateral interconnects between dies | Andreas Wolter, Bernd Waidhas, Thomas Wagner | 2021-11-16 |
| 11145577 | Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus | Sonja Koller, Reinhard Mahnkopf, Bernd Waidhas | 2021-10-12 |
| 11134573 | Printed wiring-board islands for connecting chip packages and methods of assembling same | Sonja Koller, Bernd Waidhas | 2021-09-28 |
| 11127813 | Semiconductor inductors | Bernd Waidhas, Thomas Wagner, Andreas Wolter, Andreas Augustin | 2021-09-21 |
| 11107763 | Interconnect structure for stacked die in a microelectronic device | Thomas Wagner, Andreas Wolter | 2021-08-31 |
| 11081541 | Method of providing partial electrical shielding | Veronica Sciriha | 2021-08-03 |
| 11031699 | Antenna with graded dielectirc and method of making the same | Saravana Maruthamuthu, Bernd Waidhas, Andreas Augustin | 2021-06-08 |
| 11018114 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Bernd Waidhas, Andreas Augustin, Laurent Millou, Andreas Wolter, Reinhard Mahnkopf +2 more | 2021-05-25 |