Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211337 | Face-up fan-out electronic package with passive components using a support | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2021-12-28 |
| 11177220 | Vertical and lateral interconnects between dies | Georg Seidemann, Andreas Wolter, Thomas Wagner | 2021-11-16 |
| 11145577 | Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus | Sonja Koller, Georg Seidemann, Reinhard Mahnkopf | 2021-10-12 |
| 11134573 | Printed wiring-board islands for connecting chip packages and methods of assembling same | Georg Seidemann, Sonja Koller | 2021-09-28 |
| 11127813 | Semiconductor inductors | Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin | 2021-09-21 |
| 11031699 | Antenna with graded dielectirc and method of making the same | Saravana Maruthamuthu, Andreas Augustin, Georg Seidemann | 2021-06-08 |
| 11018114 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter, Reinhard Mahnkopf +2 more | 2021-05-25 |