Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11211337 | Face-up fan-out electronic package with passive components using a support | Lizabeth Keser, Thomas Ort, Bernd Waidhas | 2021-12-28 | $27,770,000 |
| 11177220 | Vertical and lateral interconnects between dies | Georg Seidemann, Andreas Wolter, Bernd Waidhas | 2021-11-16 | $23,453,000 |
| 11127813 | Semiconductor inductors | Georg Seidemann, Bernd Waidhas, Andreas Wolter, Andreas Augustin | 2021-09-21 | $30,488,000 |
| 11107763 | Interconnect structure for stacked die in a microelectronic device | Andreas Wolter, Georg Seidemann | 2021-08-31 | $22,590,000 |
| 11018114 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter +2 more | 2021-05-25 |