Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145577 | Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus | Georg Seidemann, Reinhard Mahnkopf, Bernd Waidhas | 2021-10-12 |
| 11134573 | Printed wiring-board islands for connecting chip packages and methods of assembling same | Georg Seidemann, Bernd Waidhas | 2021-09-28 |
| 11037855 | Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatus | Reinhard Mahnkopf | 2021-06-15 |