Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930541 | Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip package | Thomas Kilger, Maciej Wojnowski | 2021-02-23 |
| 10916484 | Electronic device including redistribution layer pad having a void | Robert Fehler, Christian Geissler, Walter Hartner, Gerhard Haubner, Thorsten Meyer +2 more | 2021-02-09 |