Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081413 | Semiconductor package with inner and outer cavities | Hsin-Lin WU, Yu-Hsuan Tsai, Lu-Ming Lai, Ching-Han Huang | 2021-08-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081413 | Semiconductor package with inner and outer cavities | Hsin-Lin WU, Yu-Hsuan Tsai, Lu-Ming Lai, Ching-Han Huang | 2021-08-03 |