Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081393 | Method for splitting semiconductor wafers | Francisco Javier Santos Rodriguez, Hans-Joachim Schulze, Marko Swoboda | 2021-08-03 |
| 11059202 | Method and device for producing planar modifications in solid bodies | Ralf Rieske, Christoph Guenther, Jan Richter, Marko Swoboda | 2021-07-13 |
| 11014199 | Method of modifying a solid using laser light | — | 2021-05-25 |
| 11004723 | Wafer production method | Wolfram Drescher, Jan Richter | 2021-05-11 |
| 10994442 | Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam | Marko Swoboda, Franz Schilling, Jan Richter | 2021-05-04 |
| 10978311 | Method for thinning solid body layers provided with components | Wolfram Drescher, Marko Swoboda, Ralf Rieske, Jan Richter | 2021-04-13 |
| 10960574 | Combined wafer production method with a receiving layer having holes | Jan Richter, Anas Ajaj | 2021-03-30 |
| 10930560 | Laser-based separation method | Jan Richter | 2021-02-23 |
| 10898708 | System and method for applying pulsed electromagnetic fields | Alfredo Franco-Obregon, Chuen Neng Lee, Wee Chuan Melvin Loh, Jürg Hans Fröhlich, Tien Min David Lai | 2021-01-26 |