Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10960574 | Combined wafer production method with a receiving layer having holes | Jan Richter, Christian Beyer | 2021-03-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10960574 | Combined wafer production method with a receiving layer having holes | Jan Richter, Christian Beyer | 2021-03-30 |