Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004828 | Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices | Brandon P. Wirz, Pei Sian Shao | 2021-05-11 |
| 10916487 | Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant | Xiao Li, Jaspreet S. Gandhi | 2021-02-09 |