BL

Bongsub Lee

IT Invensas Bonding Technologies: 2 patents #11 of 15Top 75%
Overall (2021): #177,050 of 548,734Top 35%
2
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11004757 Bonded structures Rajesh Katkar, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh 2021-05-11
10998292 Offset pads over TSV Guilian Gao 2021-05-04