Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011537 | Vertical interconnect methods for stacked device architectures using direct self assembly with high operational parallelization and improved scalability | Aaron D. Lilak, Patrick Morrow, Rishabh Mehandru, Stephen M. Cea | 2021-05-18 |
| 10991696 | Vertically stacked devices with self-aligned regions formed by direct self assembly (DSA) processing | Aaron D. Lilak, Cory E. Weber, Stephen M. Cea, Rishabh Mehandru | 2021-04-27 |