Patrick Theofanis — 2 Patents at Intel

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11011537	Vertical interconnect methods for stacked device architectures using direct self assembly with high operational parallelization and improved scalability	Aaron D. Lilak, Patrick Morrow, Rishabh Mehandru, Stephen M. Cea	2021-05-18	$44,170,000
10991696	Vertically stacked devices with self-aligned regions formed by direct self assembly (DSA) processing	Aaron D. Lilak, Cory E. Weber, Stephen M. Cea, Rishabh Mehandru	2021-04-27	$44,593,000