Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088062 | Method to enable 30 microns pitch EMIB or below | Hongxia Feng, Dingying Xu, Sheng Li, Matthew Tingey, Chung Kwang Christopher Tan | 2021-08-10 |
| 10971416 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov +4 more | 2021-04-06 |