Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056179 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | Chong J. Zhao, James A. McCall, Shigeki Tomishima, Kuljit S. Bains | 2021-07-06 |
| 10970239 | Hub circuit for a DIMM having multiple components that communicate with a host | Rajesh Bhaskar, Kenneth P. Foust | 2021-04-06 |
| 10969974 | Power-based dynamic adjustment of memory module bandwidth | Douglas Heymann, Dat Le, John R. Goles | 2021-04-06 |
| 10963404 | High bandwidth DIMM | James A. McCall, Rajat Agarwal, Bill Nale | 2021-03-30 |
| 10950958 | Memory module connector, memory module, and pivotable latch | Phil Geng, Xiang Li, Mani N. Prakash | 2021-03-16 |
| 10943640 | Apparatus, method and system for providing termination for multiple chips of an integrated circuit package | Kuljit S. Bains, James A. McCall, Ge Chang | 2021-03-09 |
| 10923859 | Crosstalk reducing connector pin geometry | Jaejin Lee, Jun Liao, Xiang Li, Christopher E. Cox | 2021-02-16 |
| 10884958 | DIMM for a high bandwidth memory channel | Rajat Agarwal, Bill Nale, Chong J. Zhao, James A. McCall | 2021-01-05 |
| 10888010 | Retention of dual in-line memory modules | Phil Geng, Xiang Li | 2021-01-05 |