Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056179 | Techniques to couple high bandwidth memory device on silicon substrate and package substrate | James A. McCall, Shigeki Tomishima, George Vergis, Kuljit S. Bains | 2021-07-06 |
| 10884958 | DIMM for a high bandwidth memory channel | Rajat Agarwal, Bill Nale, James A. McCall, George Vergis | 2021-01-05 |