Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081457 | Semiconductor package and methods of manufacturing a semiconductor package | Thomas Feil, Danny Clavette, Paul Ganitzer, Carsten von Koblinski | 2021-08-03 |
| 11031466 | Method of forming oxygen inserted Si-layers in power semiconductor devices | Robert Haase, Maximilian Roesch, Sylvain Leomant, Andreas Meiser, Bernhard Goller +1 more | 2021-06-08 |
| 11031478 | Semiconductor device having body contacts with dielectric spacers and corresponding methods of manufacture | Wei Huang, Thomas Feil, Maximilian Roesch | 2021-06-08 |
| 10991812 | Transistor device with a rectifier element between a field electrode and a source electrode | Ralf Siemieniec, Robert Haase, Gerhard Noebauer | 2021-04-27 |
| 10971449 | Semiconductor device with metallization structure on opposite sides of a semiconductor portion | Paul Ganitzer | 2021-04-06 |
| 10903321 | Semiconductor device and method of manufacturing a semiconductor device using an alignment layer | Oliver Blank, Franz Hirler, Maximilian Roesch, Li Juin Yip | 2021-01-26 |