Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031466 | Method of forming oxygen inserted Si-layers in power semiconductor devices | Martin Poelzl, Robert Haase, Sylvain Leomant, Andreas Meiser, Bernhard Goller +1 more | 2021-06-08 |
| 11031478 | Semiconductor device having body contacts with dielectric spacers and corresponding methods of manufacture | Wei Huang, Martin Poelzl, Thomas Feil | 2021-06-08 |
| 10903321 | Semiconductor device and method of manufacturing a semiconductor device using an alignment layer | Martin Poelzl, Oliver Blank, Franz Hirler, Li Juin Yip | 2021-01-26 |