Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081457 | Semiconductor package and methods of manufacturing a semiconductor package | Thomas Feil, Danny Clavette, Martin Poelzl, Carsten von Koblinski | 2021-08-03 |
| 10971449 | Semiconductor device with metallization structure on opposite sides of a semiconductor portion | Martin Poelzl | 2021-04-06 |