Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069626 | Molding compound and semiconductor package with a molding compound | Anton Mauder, Peter Irsigler, Hanno Melzner, Stefan Miethaner, Sebastian Schmidt +1 more | 2021-07-20 |
| 11038028 | Semiconductor device and manufacturing method | Ingo Muri, Johannes Baumgartl, Jacob Tillmann Ludwig, Iris Moder, Thomas Neidhart +2 more | 2021-06-15 |
| 11011409 | Devices with backside metal structures and methods of formation thereof | Ingo Muri, Johannes Baumgartl, Iris Moder, Thomas Neidhart, Hans-Joachim Schulze | 2021-05-18 |