Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069626 | Molding compound and semiconductor package with a molding compound | Anton Mauder, Oliver Hellmund, Peter Irsigler, Hanno Melzner, Sebastian Schmidt +1 more | 2021-07-20 |