Issued Patents 2021
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195942 | Semiconductor device including electrode trench structure and isolation trench structure and manufacturing method therefore | Hans-Juergen Thees | 2021-12-07 |
| 11177354 | Method of manufacturing silicon carbide semiconductor devices | Andreas Meiser, Caspar Leendertz, Roland Rupp | 2021-11-16 |
| 11171230 | Semiconductor device and method for manufacturing a semiconductor device | Johannes Georg Laven, Hans-Joachim Schulze, Werner Schustereder | 2021-11-09 |
| 11171202 | Power semiconductor device having fully depleted channel regions | Franz-Josef Niedernostheide, Christian Philipp Sandow | 2021-11-09 |
| 11146258 | Method of over current and over voltage protection of a power switch in combination with regulated DI/DT and DV/DT | Karl Norling, Johannes Groeger, Bernhard Wicht | 2021-10-12 |
| 11121220 | Semiconductor device including trench structures and manufacturing method | Andreas Meiser, Caspar Leendertz, Roland Rupp | 2021-09-14 |
| 11069626 | Molding compound and semiconductor package with a molding compound | Oliver Hellmund, Peter Irsigler, Hanno Melzner, Stefan Miethaner, Sebastian Schmidt +1 more | 2021-07-20 |
| 11018249 | Semiconductor component with edge termination region | Hans-Joachim Schulze, Matteo Dainese, Elmar Falck, Franz-Josef Niedernostheide, Manfred Pfaffenlehner | 2021-05-25 |
| 11018051 | Power semiconductor device with reliably verifiable p-contact and method | Markus Beninger-Bina, Matteo Dainese, Ingo Dirnstorfer, Erich Griebl, Johannes Georg Laven +1 more | 2021-05-25 |
| 11011606 | Semiconductor component having a SiC semiconductor body and method for producing a semiconductor component | Andreas Meiser, Caspar Leendertz | 2021-05-18 |
| 10989742 | Magnetic current sensor | Martin Gruber, Goran Keser | 2021-04-27 |
| 10991832 | Power diode | Mario Barusic | 2021-04-27 |
| 10985248 | SiC power semiconductor device with integrated Schottky junction | Caspar Leendertz, Romain Esteve, Andreas Meiser, Bernd Zippelius | 2021-04-20 |
| 10978596 | Power diode and method of manufacturing a power diode | Mario Barusic, Markus Bina, Matteo Dainese | 2021-04-13 |
| 10971620 | Method for producing a semiconductor arrangement | Joachim Weyers, Andreas J. Boehm, Patrick Schindler, Stefan Tegen, Armin Tilke +1 more | 2021-04-06 |
| 10971435 | Semiconductor device including bonding pad and bond wire or clip | Hans-Joachim Schulze | 2021-04-06 |
| 10950718 | IGBT with fully depletable n- and p-channel regions | Thomas Kuenzig, Franz-Josef Niedernostheide, Christian Philipp Sandow | 2021-03-16 |
| 10903353 | Double gate transistor device and method of operating | Markus Bina, Jens Barrenscheen | 2021-01-26 |
| 10903322 | SiC power semiconductor device with integrated body diode | Andreas Meiser, Caspar Leendertz | 2021-01-26 |