Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2021-11-16 |
VO
Valerie Oberson
Overall (2021): #222,000 of 548,734Top 45%
1
Patents 2021