Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133181 | Formation of SiN thin films | Toshiya Suzuki, Viljami Pore, Shang Chen, Ryoko Yamada, Kunitoshi Namba | 2021-09-28 |
| 11040416 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Yuki KAWANA, Chie Sugama, Hideo Nakako, Yoshinori Ejiri, Kazuhiko Kurafuchi | 2021-06-22 |
| 10930612 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Chie Sugama, Yuki KAWANA | 2021-02-23 |
| 10910262 | Method of selectively depositing a capping layer structure on a semiconductor device structure | Aurélie Kuroda, Akiko Kobayashi | 2021-02-02 |