Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11040416 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Dai Ishikawa, Yuki KAWANA, Chie Sugama, Hideo Nakako, Yoshinori Ejiri | 2021-06-22 |
| 10930612 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2021-02-23 |