Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10950500 | Methods and apparatus for filling a feature disposed in a substrate | Roey Shaviv, Xikun Wang, Ismail Emesh, Jianxin Lei | 2021-03-16 | $56,717,000 |
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Skip to contentShowing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10950500 | Methods and apparatus for filling a feature disposed in a substrate | Roey Shaviv, Xikun Wang, Ismail Emesh, Jianxin Lei | 2021-03-16 | $56,717,000 |