Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189540 | Arrangement and thermal management of 3D stacked dies | John Wuu, Patrick J. Shyvers, Milind S. Bhagavat, Kaushik Mysore, Brett P. Wilkerson | 2021-11-30 |
| 11164807 | Arrangement and thermal management of 3D stacked dies | John Wuu, Patrick J. Shyvers, Milind S. Bhagavat, Kaushik Mysore, Brett P. Wilkerson | 2021-11-02 |
| 11073888 | Platform power manager for rack level power and thermal constraints | Indrani Paul, Sriram Sambamurthy, Larry D. Hewitt, Kevin M. Lepak, Adam Neil Calder Clark +6 more | 2021-07-27 |
| 11054883 | Power efficiency optimization in throughput-based workloads | Leonardo Piga, Ivan Matosevic, Indrani Paul | 2021-07-06 |