Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189540 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Milind S. Bhagavat, Kaushik Mysore, Brett P. Wilkerson | 2021-11-30 |
| 11164807 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Milind S. Bhagavat, Kaushik Mysore, Brett P. Wilkerson | 2021-11-02 |