Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107791 | Semiconductor package structure and method for manufacturing the same | Chao-Hung Weng, Wei-Hang Tai, Chen-Hung LEE, Yu-Yuan Yeh | 2021-08-31 |
| 11094649 | Semiconductor package structure and method for manufacturing the same | Chen-Hung LEE, Hsiu-Chi Liu, Liang Chen | 2021-08-17 |
| 10943800 | Semiconductor package device and method of forming package body | Chao-Hung Weng, Liang Chen | 2021-03-09 |