Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107791 | Semiconductor package structure and method for manufacturing the same | Fan-Yu MIN, Chao-Hung Weng, Wei-Hang Tai, Chen-Hung LEE | 2021-08-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107791 | Semiconductor package structure and method for manufacturing the same | Fan-Yu MIN, Chao-Hung Weng, Wei-Hang Tai, Chen-Hung LEE | 2021-08-31 |