Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11107791 | Semiconductor package structure and method for manufacturing the same | Fan-Yu MIN, Chao-Hung Weng, Wei-Hang Tai, Yu-Yuan Yeh | 2021-08-31 | $2,137,000 |
| 11094649 | Semiconductor package structure and method for manufacturing the same | Fan-Yu MIN, Hsiu-Chi Liu, Liang Chen | 2021-08-17 | $2,025,000 |