Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11094649 | Semiconductor package structure and method for manufacturing the same | Fan-Yu MIN, Chen-Hung LEE, Hsiu-Chi Liu | 2021-08-17 | $2,025,000 |
| 10943800 | Semiconductor package device and method of forming package body | Fan-Yu MIN, Chao-Hung Weng | 2021-03-09 | $3,126,000 |